Invention Grant
US09126288B2 Laser cutting method, laser cutting nozzle, and laser cutting device
有权
激光切割方法,激光切割喷嘴和激光切割装置
- Patent Title: Laser cutting method, laser cutting nozzle, and laser cutting device
- Patent Title (中): 激光切割方法,激光切割喷嘴和激光切割装置
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Application No.: US13637971Application Date: 2011-02-21
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Publication No.: US09126288B2Publication Date: 2015-09-08
- Inventor: Masayuki Nagahori , Shinji Numata , Masafumi Itoyama
- Applicant: Masayuki Nagahori , Shinji Numata , Masafumi Itoyama
- Applicant Address: JP Saitama
- Assignee: NISSAN TANAKA CORPORATION
- Current Assignee: NISSAN TANAKA CORPORATION
- Current Assignee Address: JP Saitama
- Agency: Nixon Peabody LLP
- Priority: JP2010-075744 20100329
- International Application: PCT/JP2011/053623 WO 20110221
- International Announcement: WO2011/122159 WO 20111006
- Main IPC: B23K26/00
- IPC: B23K26/00 ; B23K26/38 ; B23K26/14

Abstract:
A laser cutting nozzle configured such that a laser beam is irradiated through a nozzle hole formed in a nozzle main body from an opening of the nozzle hole, and an assist gas surrounding the laser beam is emitted. The nozzle hole includes a first control flow path, a second control flow path, and a third control flow path formed in a coaxial cylindrical shape, in sequence from upstream toward downstream in a flow direction of the assist gas. If a diameter of the first control flow path is φA, a diameter of the second control flow path is φB, and a diameter of the third control flow path is φC, an equation φA
Public/Granted literature
- US20130015168A1 LASER CUTTING METHOD, LASER CUTTING NOZZLE, AND LASER CUTTING DEVICE Public/Granted day:2013-01-17
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