Invention Grant
- Patent Title: Device for positioning cutting particles
- Patent Title (中): 切割颗粒定位装置
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Application No.: US13136073Application Date: 2011-07-22
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Publication No.: US09126310B2Publication Date: 2015-09-08
- Inventor: Marcus Flock
- Applicant: Marcus Flock
- Applicant Address: LI Schaan
- Assignee: Hilti Aktiengesellschaft
- Current Assignee: Hilti Aktiengesellschaft
- Current Assignee Address: LI Schaan
- Agency: Davidson, Davidson & Kappel, LLC
- Priority: DE102010038324 20100723
- Main IPC: B25B11/00
- IPC: B25B11/00 ; B24D18/00 ; B23D61/18

Abstract:
A device (1) for positioning cutting particles (2a-c), including a receiver (4) that has a first receiving opening (5a) to receive a first cutting particle (2a), and a second receiving opening (5b) to receive a second cutting particle (2b), and comprising a unit or generator (7) for generating a holding force that affixes the cutting particles (2a; 2b) in the receiving openings (5a, 5b), and the holding force that affixes the first cutting particle (2a) in the first receiving opening (5a) can be adjusted independently of the holding force that affixes the second cutting particle (2b) in the second receiving opening (5b).
Public/Granted literature
- US20120193854A1 Device for positioning cutting particles Public/Granted day:2012-08-02
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