Invention Grant
- Patent Title: Microscopic geometry cutting device and microscopic geometry cutting method
- Patent Title (中): 微观几何切割装置和微观几何切割方法
-
Application No.: US14047922Application Date: 2013-10-07
-
Publication No.: US09126347B2Publication Date: 2015-09-08
- Inventor: Seiji Kimura , Sumihisa Kondo
- Applicant: Toshiba Kikai Kabushiki Kaisha
- Applicant Address: JP Chiyoda-ku, Tokyo
- Assignee: TOSHIBA KIKAI KABUSHIKI KAISHA
- Current Assignee: TOSHIBA KIKAI KABUSHIKI KAISHA
- Current Assignee Address: JP Chiyoda-ku, Tokyo
- Agency: DLA Piper LLP (US)
- Priority: JP2007-188024 20070719; JP2008-135404 20080523
- Main IPC: B23D3/00
- IPC: B23D3/00 ; B26D3/08 ; B23B29/12 ; G05B19/416

Abstract:
A microscopic geometry cutting device includes: a controller that outputs a timer count start command in starting a driving program which controls a drive of an X-axis or a Y-axis moving mechanism; an arrival time calculator that calculates an arrival time from when the timer count start command is output till when the cutter arrives at a machining start position in accordance with relative moving speed information of the moving mechanisms and machining start position information of a workpiece W; an elapsed time determiner that determines whether an elapsed time from when the timer count start command is output is coincident with the arrival time and outputs a trigger signal when the elapsed time is coincident with the arrival time; and a reciprocating stage driver that drives the reciprocating stage in a manner that the cutter advances and retracts in a predetermined cutting depth in response to the trigger signal.
Public/Granted literature
- US20140033890A1 MICROSCOPIC GEOMETRY CUTTING DEVICE AND MICROSCOPIC GEOMETRY CUTTING METHOD Public/Granted day:2014-02-06
Information query