Invention Grant
- Patent Title: Liquid ejecting head unit and liquid ejecting apparatus
- Patent Title (中): 液体喷射头单元和液体喷射装置
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Application No.: US14302789Application Date: 2014-06-12
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Publication No.: US09126408B2Publication Date: 2015-09-08
- Inventor: Takahiro Kanegae
- Applicant: Seiko Epson Corporation
- Applicant Address: JP
- Assignee: Seiko Epson Corporation
- Current Assignee: Seiko Epson Corporation
- Current Assignee Address: JP
- Agency: Harness, Dickey & Pierce, P.L.C.
- Priority: JP2013-126894 20130617
- Main IPC: B41J2/175
- IPC: B41J2/175 ; B41J2/14

Abstract:
A liquid ejecting head unit includes a liquid ejecting head; an upstream flow path member that includes upstream flow paths; a downstream flow path member that includes downstream flow paths; and a seal member that includes pipe-shaped portions, which connect the upstream flow paths to the downstream flow paths and are provided with connecting flow paths through the inner portions of which a liquid flows, and is formed of an elastic material. The pipe-shaped portions are sealed due to inner walls thereof abutting at least one of the upstream flow path member and the downstream flow path member. The inner walls of the pipe-shaped portions include retaining portions that are provided along outer circumferences of the pipe-shaped portions so as to surround a region of the inner walls that abuts at least one of the upstream flow path member and the downstream flow path member.
Public/Granted literature
- US09079401B2 Liquid ejecting head unit and liquid ejecting apparatus Public/Granted day:2015-07-14
Information query
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