Invention Grant
- Patent Title: Polypropylene-based resin composition and film
- Patent Title (中): 聚丙烯基树脂组合物和薄膜
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Application No.: US12466496Application Date: 2009-05-15
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Publication No.: US09127133B2Publication Date: 2015-09-08
- Inventor: Yukito Miyaguchi , Hideaki Hori
- Applicant: Yukito Miyaguchi , Hideaki Hori
- Applicant Address: JP Tokyo
- Assignee: SUMITOMO CHEMICAL COMPANY, LIMITED
- Current Assignee: SUMITOMO CHEMICAL COMPANY, LIMITED
- Current Assignee Address: JP Tokyo
- Agency: Sughrue Mion, PLLC
- Priority: JP2008-135286 20080523
- Main IPC: C08L23/00
- IPC: C08L23/00 ; C08J5/18 ; C08L23/14

Abstract:
A polypropylene-based resin composition comprising 61 to 85% by weight of a copolymer (X) of propylene, α-olefin having 4 or more of carbon atoms and/or ethylene, in which a content of a constitutional unit derived from propylene is 86 to 97% by weight, a total of a content of a constitutional unit derived from ethylene and a content of a constitutional unit derived from α-olefin having 4 or more of carbon atoms is 3 to 14% by weight, provided that a total of the content of a constitutional unit derived from propylene, the content of a constitutional unit derived from ethylene and the content of a constitutional unit derived from α-olefin having 4 or more of carbon atoms is defined to be 100% by weight, 1 to 38% by weight of a copolymer (Y) of propylene and α-olefin having 4 or more of carbon atoms, in which a melting point is 115° C. or more, and a content of a constitutional unit derived from α-olefin having 4 or more of carbon atoms is 10 to 30% by weight, and 1 to 38% by weight of a copolymer (Z) of propylene and α-olefin having 4 or more of carbon atoms, in which a melting point is less than 115° C., and a content of a constitutional unit derived from α-olefin having 4 or more of carbon atoms is 30 to 40% by weight, wherein a total of the copolymer (X), the copolymer (Y) and the copolymer (Z) is defined to be 100% by weight.
Public/Granted literature
- US20090292076A1 POLYPROPYLENE-BASED RESIN COMPOSITION AND FILM Public/Granted day:2009-11-26
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