Invention Grant
- Patent Title: Molding and overmolding compositions for electronic devices
- Patent Title (中): 用于电子设备的成型和包覆成型组合物
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Application No.: US13804811Application Date: 2013-03-14
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Publication No.: US09127153B2Publication Date: 2015-09-08
- Inventor: Cynthia L. Cain , Charles W. Paul , Maria Cristina Barbosa DeJesus
- Applicant: HENKEL IP & HOLDING GMBH
- Applicant Address: DE Duesseldorf
- Assignee: HENKEL IP & HOLDING GMBH
- Current Assignee: HENKEL IP & HOLDING GMBH
- Current Assignee Address: DE Duesseldorf
- Agent Sun Hee Lehmann
- Main IPC: C08L53/00
- IPC: C08L53/00 ; B29C45/14 ; B32B27/30 ; B29C33/12 ; B29C45/00
Abstract:
The present invention relates to molding and overmolding compositions for delicate components. More particularly the invention relates to compositions for low pressure molding and overmolding, making these compositions particularly well suited for electronic devices. The molding and overmolding composition is suitable for low pressure injection molding processes, particularly at 0.5 to 200 bars at 70° C. to 240° C.
Public/Granted literature
- US20140127445A1 MOLDING AND OVERMOLDING COMPOSITIONS FOR ELECTRONIC DEVICES Public/Granted day:2014-05-08
Information query
