Invention Grant
- Patent Title: Cover tape for electronic component packaging
- Patent Title (中): 电子元件包装用胶带
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Application No.: US13824788Application Date: 2011-09-28
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Publication No.: US09127190B2Publication Date: 2015-09-08
- Inventor: Ken Masui , Masayuki Hiramatsu
- Applicant: Ken Masui , Masayuki Hiramatsu
- Applicant Address: JP Tokyo
- Assignee: SUMITOMO BAKELITE, CO., LTD
- Current Assignee: SUMITOMO BAKELITE, CO., LTD
- Current Assignee Address: JP Tokyo
- Agency: Amin, Turocy & Watson, LLP
- Priority: JP2010-221536 20100930; JP2011-072187 20110329
- International Application: PCT/JP2011/072150 WO 20110928
- International Announcement: WO2012/043608 WO 20120405
- Main IPC: C09J11/06
- IPC: C09J11/06 ; H05F3/00 ; B32B7/12 ; B32B27/08 ; B32B27/30 ; B32B27/32 ; B65D73/02 ; B65D50/06
Abstract:
According to the present invention, a cover tape for electronic component packaging is provided which has suitable transparency, and which enables suppression of the charge that occurs during peeling from carrier tape. The cover tape for electronic component packaging of the present invention is provided with a heat sealant layer on top of the base layer, and the aforementioned heat sealant layer contains polyolefin resin and polyether-polyolefin copolymer. The weight ratio of the polyether-polyolefin copolymer in the aforementioned heat sealant layer is 10 weight % or more and 70 weight % or less.
Public/Granted literature
- US20130244027A1 COVER TAPE FOR ELECTRONIC COMPONENT PACKAGING Public/Granted day:2013-09-19
Information query
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