Invention Grant
- Patent Title: Method for manufacturing nitride semiconductor self-supporting substrate and nitride semiconductor self-supporting substrate
- Patent Title (中): 氮化物半导体自支撑基板和氮化物半导体自支撑基板的制造方法
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Application No.: US12448272Application Date: 2007-12-05
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Publication No.: US09127376B2Publication Date: 2015-09-08
- Inventor: Shoichi Takamizawa , Masataka Watanabe
- Applicant: Shoichi Takamizawa , Masataka Watanabe
- Applicant Address: JP Tokyo
- Assignee: SHIN-ETSU HANDOTAI CO., LTD.
- Current Assignee: SHIN-ETSU HANDOTAI CO., LTD.
- Current Assignee Address: JP Tokyo
- Agency: Oliff PLC
- Priority: JP2006-349756 20061226
- International Application: PCT/JP2007/001351 WO 20071205
- International Announcement: WO2008/078401 WO 20080703
- Main IPC: C30B29/40
- IPC: C30B29/40 ; C23C16/448 ; C30B25/02 ; H01L21/02

Abstract:
The present invention provides a method for manufacturing a nitride semiconductor self-supporting substrate and a nitride semiconductor self-supporting substrate manufactured by this manufacturing method, the method including at least: a step of preparing a nitride semiconductor self-supporting substrate serving as a seed substrate; a step of epitaxially growing the same type of nitride semiconductor as the seed substrate on the seed substrate; and a step of slicing an epitaxially grown substrate subjected to the epitaxial growth into two pieces in parallel to an epitaxial growth surface. As a result, there is provided a method for manufacturing a large-diameter nitride semiconductor self-supporting substrate having an excellent crystal quality and small warp with good productivity at a low cost, etc.
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