Invention Grant
- Patent Title: Conduit joining apparatus
- Patent Title (中): 导管接合装置
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Application No.: US12593671Application Date: 2008-03-28
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Publication No.: US09127795B2Publication Date: 2015-09-08
- Inventor: Sun Chan
- Applicant: Sun Chan
- Agent Richard M. Goldberg
- Priority: AU2007901708 20070330
- International Application: PCT/AU2008/000442 WO 20080328
- International Announcement: WO2008/119112 WO 20081009
- Main IPC: F16L21/08
- IPC: F16L21/08 ; F16L21/06 ; F16L21/00 ; F16L27/10 ; F16L37/12

Abstract:
Apparatus for joining a first conduit to a second conduit comprising a first coupler for attachment to an end of the first conduit, a second coupler for attachment to an end of the second conduit and for engagement to the first coupler, and a snap-fit fastener for fastening the first coupler to the second coupler. The snap-fit fastener is arranged in at least two portions to fit around the periphery of the first and second couplers when the first and second couplers are engaged. The apparatus enables relative movement between the first coupler and the second coupler.
Public/Granted literature
- US20100117360A1 Conduit Joining Apparatus Public/Granted day:2010-05-13
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