Invention Grant
- Patent Title: Heat source unit
- Patent Title (中): 热源单元
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Application No.: US13358546Application Date: 2012-01-26
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Publication No.: US09127867B2Publication Date: 2015-09-08
- Inventor: Hideki Tanno , Masahiro Okada , Kenjiro Matsumoto , Takamitsu Ishiguro
- Applicant: Hideki Tanno , Masahiro Okada , Kenjiro Matsumoto , Takamitsu Ishiguro
- Applicant Address: unknown Minato-ku, Tokyo
- Assignee: Toshiba Carrier Corporation
- Current Assignee: Toshiba Carrier Corporation
- Current Assignee Address: unknown Minato-ku, Tokyo
- Agency: DLA Piper LLP (US)
- Priority: JP2009-175624 20090728; JP2009-175625 20090728
- Main IPC: F25B30/02
- IPC: F25B30/02 ; F24F3/06 ; F28B1/06 ; F28D1/047 ; F28D1/02 ; F28F1/32 ; F28F9/26

Abstract:
According to one embodiment, a heat source unit apparatus includes air heat exchangers, each includes a plurality of fins arranged at prescribed intervals, heat exchanging pipes penetrating the fins, and bent strips extending at sides and bent in the same direction, and a heat exchange module includes two air heat exchangers, each having the bent strips opposed to those of the other air heat exchanger, the air heat exchangers being inclined such that lower edges are close to each other and upper edges are spaced apart, whereby the heat exchange module is shaped like a letter V as seen from side.
Public/Granted literature
- US20120125033A1 HEAT SOURCE UNIT Public/Granted day:2012-05-24
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