Invention Grant
- Patent Title: Thickness-information acquisition apparatus, thickness-information acquisition method, thickness-information acquisition program and microscope
- Patent Title (中): 厚度信息获取装置，厚度信息获取方法，厚度信息采集程序和显微镜
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Application No.: US12970088Application Date: 2010-12-16
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Publication No.: US09127931B2Publication Date: 2015-09-08
- Inventor: Takashi Yamamoto
- Applicant: Takashi Yamamoto
- Applicant Address: JP Tokyo
- Assignee: Sony Corporation
- Current Assignee: Sony Corporation
- Current Assignee Address: JP Tokyo
- Agency: K&L Gates LLP
- Priority: JPP2009-295380 20091225
- Main IPC: G01B11/00
- IPC: G01B11/00 ; G01B11/06 ; G01B9/04 ; G02B21/14
Abstract:
A thickness-information acquisition apparatus includes: an image acquisition section configured to acquire a phase-difference image of a sample; a correlation-distribution computation section configured to compute a correlation distribution of an image in the phase-difference image with respect to pixels of another image in the phase-difference image; and a thickness-information acquisition section configured to acquire information on the thickness of the sample in accordance with the correlation distribution.
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