Invention Grant
- Patent Title: Sensor module, force detecting device, and robot
- Patent Title (中): 传感器模块,力检测装置和机器人
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Application No.: US13788482Application Date: 2013-03-07
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Publication No.: US09127996B2Publication Date: 2015-09-08
- Inventor: Hiroki Kawai , Toshiyuki Kamiya , Takanobu Matsumoto
- Applicant: Seiko Epson Corporation
- Applicant Address: JP
- Assignee: Seiko Epson Corporation
- Current Assignee: Seiko Epson Corporation
- Current Assignee Address: JP
- Agency: Harness, Dickey & Pierce, P.L.C.
- Priority: JP2012-052623 20120309
- Main IPC: G01L1/16
- IPC: G01L1/16 ; B25J13/08 ; G01L5/16 ; G01L5/22

Abstract:
A sensor module includes a first member including a first recess in which a piezoelectric element including an electrode is arranged, a second member joined to the first member, a first plate in contact with the second member, a second plate in contact with the first member, and a fastening section configured to fasten the first plate and the second plate. A first projection projecting toward the second member is provided on the first plate. The internal height of the first recess of the first member is larger than the height of the piezoelectric element. The piezoelectric element is in contact with the second member.
Public/Granted literature
- US20130233089A1 SENSOR MODULE, FORCE DETECTING DEVICE, AND ROBOT Public/Granted day:2013-09-12
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