Invention Grant
US09128382B2 Plasma mediated ashing processes that include formation of a protective layer before and/or during the plasma mediated ashing process
有权
血浆介导的灰化过程包括在血浆介导的灰化过程之前和/或期间形成保护层
- Patent Title: Plasma mediated ashing processes that include formation of a protective layer before and/or during the plasma mediated ashing process
- Patent Title (中): 血浆介导的灰化过程包括在血浆介导的灰化过程之前和/或期间形成保护层
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Application No.: US14072304Application Date: 2013-11-05
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Publication No.: US09128382B2Publication Date: 2015-09-08
- Inventor: Ivan Berry , Orlando Escorcia , Keping Han , Jianan Hou , Shijian Luo , Carlo Waldfried
- Applicant: Lam Research Corporation
- Applicant Address: US CA Fremont
- Assignee: LAM RESEARCH CORPORATION
- Current Assignee: LAM RESEARCH CORPORATION
- Current Assignee Address: US CA Fremont
- Main IPC: C23F1/00
- IPC: C23F1/00 ; B44C1/22 ; G03F7/38 ; G03F7/42 ; H01J37/32 ; H01L21/311
Abstract:
A method for processing a substrate includes arranging a substrate including masked portions and unmasked portions in a process chamber; creating plasma in a process chamber; supplying a passivation gas mixture that includes nitrogen or carbon to create a plasma passivation gas mixture; exposing a substrate to the plasma passivation gas mixture to create a passivation layer on the unmasked portions of the substrate; supplying a stripping gas mixture that includes oxygen to the plasma to create a plasma stripping gas mixture; exposing the substrate to the plasma stripping gas mixture to strip at least part of the masked portions and at least part of the unmasked portions; and repeating creating the passivation layer and the stripping to remove a predetermined amount of the masked portions.
Public/Granted literature
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