Invention Grant
- Patent Title: Semiconductor integrated circuit
- Patent Title (中): 半导体集成电路
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Application No.: US13602153Application Date: 2012-09-01
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Publication No.: US09128914B2Publication Date: 2015-09-08
- Inventor: Yoshiki Kobayashi
- Applicant: Yoshiki Kobayashi
- Applicant Address: JP Yokohama
- Assignee: LAPIS Semiconductor Co., Ltd.
- Current Assignee: LAPIS Semiconductor Co., Ltd.
- Current Assignee Address: JP Yokohama
- Agency: Studebaker & Brackett PC
- Priority: JP2011-190716 20110901
- Main IPC: G01R31/08
- IPC: G01R31/08 ; G06F11/22

Abstract:
Disclosed is a semiconductor integrated circuit capable of efficiently performing debugging. The semiconductor integrated circuit includes a distributing part distributing received packets according to destinations of the packets, a plurality of accumulating parts sequentially accumulating the packets distributed thereto, respectively, a plurality of relaying parts supplying the packets accumulated in one of the accumulating parts to corresponding one of the processing parts, respectively, and an output controlling part assigning the relay permission command to one relaying part designated by a relay permission packet from among the relaying parts when a packet distributed thereto from the distributing part is determined as the relay permission packet.
Public/Granted literature
- US20130058207A1 SEMICONDUCTOR INTEGRATED CIRCUIT Public/Granted day:2013-03-07
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