Invention Grant
- Patent Title: Ceramic electronic component and method of manufacturing the same
- Patent Title (中): 陶瓷电子元件及其制造方法
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Application No.: US14046446Application Date: 2013-10-04
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Publication No.: US09129752B2Publication Date: 2015-09-08
- Inventor: Jong Han Kim , Hyun Chul Jeong
- Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Applicant Address: KR Suwon-Si, Gyeonggi-Do
- Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee Address: KR Suwon-Si, Gyeonggi-Do
- Agency: McDermott Will & Emery LLP
- Priority: KR10-2011-0088030 20110831
- Main IPC: H01G4/30
- IPC: H01G4/30 ; H01C7/10 ; H01C7/18 ; H01G4/008 ; H01C7/13 ; H01G4/12

Abstract:
There are provided a ceramic electronic component and a method of manufacturing the same. The ceramic electronic component includes: a ceramic element; and an internal electrode layer formed within the ceramic element, having a thickness of 0.5 μm or less, and including a non-electrode region formed therein, wherein an area ratio of the non-electrode region to an electrode region of the internal electrode layer, in a cross section of the internal electrode layer is between 0.1% and 10%, and the non-electrode region includes a ceramic component.
Public/Granted literature
- US20140036408A1 CERAMIC ELECTRONIC COMPONENT AND METHOD OF MANUFACTURING THE SAME Public/Granted day:2014-02-06
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