Invention Grant
- Patent Title: Semiconductor device
- Patent Title (中): 半导体器件
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Application No.: US14467474Application Date: 2014-08-25
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Publication No.: US09129837B2Publication Date: 2015-09-08
- Inventor: Yoshihiro Takaishi
- Applicant: Micron Technology, Inc.
- Applicant Address: US ID Boise
- Assignee: Micron Technology, Inc.
- Current Assignee: Micron Technology, Inc.
- Current Assignee Address: US ID Boise
- Agency: Wells St. John, P.S.
- Priority: JP2013-195654 20130920
- Main IPC: H01L21/8234
- IPC: H01L21/8234 ; H01L27/088 ; H01L29/78 ; H01L29/66 ; H01L29/06

Abstract:
A semiconductor device has an active region defined by a device isolation region arranged on a surface of a semiconductor substrate, a plurality of transistor pillars arranged along a first direction within the active region, and a first dummy pillar disposed in the device isolation region. The first dummy pillar is arranged on a line extending along the first direction from the transistor pillars. The semiconductor device also has a second dummy pillar disposed between the transistor pillars and the first dummy pillar, a gate electrode continuously extending so as to surround each of side surfaces of the transistor pillars, a first power supply gate electrode surrounding a side surface of the first dummy pillar, and a second power supply gate electrode surrounding a side surface of the second dummy pillar. The second power supply gate electrode is connected to the gate electrode and the first power supply gate electrode.
Public/Granted literature
- US20150084122A1 Semiconductor Device Public/Granted day:2015-03-26
Information query
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