Invention Grant
US09129857B2 Semiconductor device including a first core pattern under a second core pattern
有权
半导体器件包括在第二芯图案下的第一芯图案
- Patent Title: Semiconductor device including a first core pattern under a second core pattern
- Patent Title (中): 半导体器件包括在第二芯图案下的第一芯图案
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Application No.: US13560022Application Date: 2012-07-27
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Publication No.: US09129857B2Publication Date: 2015-09-08
- Inventor: Bi-O Kim , Byong-Ju Kim , Jung-Geun Jee , Jin-Gyun Kim , Jae-Young Ahn , Ki-Hyun Hwang
- Applicant: Bi-O Kim , Byong-Ju Kim , Jung-Geun Jee , Jin-Gyun Kim , Jae-Young Ahn , Ki-Hyun Hwang
- Applicant Address: KR Gyeonggi-do
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR Gyeonggi-do
- Agency: Harness, Dickey & Pierce, P.L.C.
- Priority: KR10-2011-0077412 20110803
- Main IPC: H01L29/792
- IPC: H01L29/792 ; H01L27/115 ; H01L21/336

Abstract:
According to example embodiments, a semiconductor device includes horizontal patterns stacked on a substrate. The horizontal patterns define an opening through the horizontal patterns. A first core pattern is in the opening. A second core pattern is in the opening on the first core pattern. A first active pattern is between the first core pattern and the horizontal patterns. A second active pattern containing a first element is between the second core pattern and the horizontal patterns. The second active pattern contains the first element at a higher concentration than a concentration of the first element in the second core pattern.
Public/Granted literature
- US20130032878A1 SEMICONDUCTOR DEVICE Public/Granted day:2013-02-07
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