Invention Grant
- Patent Title: Package structure having embedded electronic component
- Patent Title (中): 具有嵌入式电子元件的封装结构
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Application No.: US14314242Application Date: 2014-06-25
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Publication No.: US09129870B2Publication Date: 2015-09-08
- Inventor: Zhao-Chong Zeng
- Applicant: Unimicron Technology Corporation
- Applicant Address: TW Taoyuan
- Assignee: Unimicron Technology Corporation
- Current Assignee: Unimicron Technology Corporation
- Current Assignee Address: TW Taoyuan
- Agency: Mintz Levin Cohn Ferris Glovsky and Popeo, P.C.
- Agent Peter F. Corless; Steven M. Jensen
- Priority: TW100114827A 20110428
- Main IPC: H01L23/52
- IPC: H01L23/52 ; H01L23/00 ; H01L23/13 ; H01L23/538 ; H01L23/498
Abstract:
A package structure having an embedded electronic component includes: a carrier having a cavity penetrating therethrough; a semiconductor chip received in the cavity and having solder bumps disposed thereon; a dielectric layer formed on the carrier and the semiconductor chip so as to encapsulate the solder bumps; a wiring layer formed on the dielectric layer; an insulating protection layer formed on the dielectric layer and the wiring layer; and a solder material formed in the dielectric layer and the insulating protection layer for electrically connecting the wiring layer and the solder bumps, thereby shortening the signal transmission path between the semiconductor chip and the carrier to avoid signal losses.
Public/Granted literature
- US20140306340A1 PACKAGE STRUCTURE HAVING EMBEDDED ELECTRONIC COMPONENT Public/Granted day:2014-10-16
Information query
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