Invention Grant
- Patent Title: Method of manufacturing a semiconductor device including a plurality of photoelectric conversion portions
- Patent Title (中): 制造包括多个光电转换部的半导体器件的方法
-
Application No.: US13366155Application Date: 2012-02-03
-
Publication No.: US09129877B2Publication Date: 2015-09-08
- Inventor: Sho Suzuki , Takehito Okabe , Masatsugu Itahashi
- Applicant: Sho Suzuki , Takehito Okabe , Masatsugu Itahashi
- Applicant Address: JP Tokyo
- Assignee: Canon Kabushiki Kaishi
- Current Assignee: Canon Kabushiki Kaishi
- Current Assignee Address: JP Tokyo
- Agency: Canon USA Inc IP Division
- Priority: JP2011-026354 20110209; JP2011-223294 20111007
- Main IPC: H01L21/00
- IPC: H01L21/00 ; H01L27/146
Abstract:
A first waveguide member is formed, as viewed from above, in an image pickup region and a peripheral region of a semiconductor substrate. A part of the first waveguide member, which part is disposed in the peripheral region, is removed. A flattening step is then performed to flatten a surface of the first waveguide member on the side opposite to the semiconductor substrate.
Public/Granted literature
- US20120202307A1 SEMICONDUCTOR DEVICE MANUFACTURING METHOD Public/Granted day:2012-08-09
Information query
IPC分类:
