Invention Grant
US09129881B2 Solid-state imaging device with charge holding section between trenched transfer gate sections, manufacturing method of same, and electronic apparatus 有权
具有沟槽转移栅极部分之间的电荷保持部分的固态成像装置,其制造方法和电子装置

  • Patent Title: Solid-state imaging device with charge holding section between trenched transfer gate sections, manufacturing method of same, and electronic apparatus
  • Patent Title (中): 具有沟槽转移栅极部分之间的电荷保持部分的固态成像装置,其制造方法和电子装置
  • Application No.: US14331742
    Application Date: 2014-07-15
  • Publication No.: US09129881B2
    Publication Date: 2015-09-08
  • Inventor: Takahiro Kawamura
  • Applicant: Sony Corporation
  • Applicant Address: JP Tokyo
  • Assignee: Sony Corporation
  • Current Assignee: Sony Corporation
  • Current Assignee Address: JP Tokyo
  • Agency: Fishman Stewart Yamaguchi PLLC
  • Priority: JP2013-185945 20130909
  • Main IPC: H01L27/148
  • IPC: H01L27/148 H01L27/146
Solid-state imaging device with charge holding section between trenched transfer gate sections, manufacturing method of same, and electronic apparatus
Abstract:
A solid-state imaging device includes a pixel having a photoelectric conversion element which generates a charge in response to incident light, a first transfer gate which transfers the charge from the photoelectric conversion element to a charge holding section, and a second transfer gate which transfers the charge from the charge holding section to a floating diffusion. The first transfer gate includes a trench gate structure having at least two trench gate sections embedded in a depth direction of a semiconductor substrate, and the charge holding section includes a semiconductor region positioned between adjacent trench gate sections.
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