Invention Grant
- Patent Title: Semiconductor device
- Patent Title (中): 半导体器件
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Application No.: US13626137Application Date: 2012-09-25
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Publication No.: US09129891B2Publication Date: 2015-09-08
- Inventor: Akira Endoh , Issei Watanabe
- Applicant: FUJITSU LIMITED , National Institute of Information and Communications Technology
- Applicant Address: JP Kawasaki JP Tokyo
- Assignee: FUJITSU LIMITED,NATIONAL INSTITUTE OF INFORMATION AND COMMUNICATIONS TECHNOLOGY
- Current Assignee: FUJITSU LIMITED,NATIONAL INSTITUTE OF INFORMATION AND COMMUNICATIONS TECHNOLOGY
- Current Assignee Address: JP Kawasaki JP Tokyo
- Agency: Kratz, Quintos & Hanson
- Priority: JP2011-211076 20110927
- Main IPC: H01L29/778
- IPC: H01L29/778 ; H01L29/205 ; H01L29/66

Abstract:
A semiconductor device includes a first semiconductor layer provided over a substrate; an electron transit layer contacting a top of the first semiconductor layer; and a second semiconductor layer contacting a top of the electron transit layer, wherein the electron transit layer has a dual quantum well layer having a structure where a first well layer, an intermediate barrier layer, and a second well layer are sequentially stacked, an energy of a conduction band of the intermediate barrier layer is lower than an energy of conduction band of the first semiconductor layer and the second semiconductor layer, and a ground level is generated in the first and second well layers, and a first excitation level is generated in the dual quantum well layer.
Public/Granted literature
- US20130075698A1 SEMICONDUCTOR DEVICE Public/Granted day:2013-03-28
Information query
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