Invention Grant
- Patent Title: Semiconductor device and manufacturing method thereof
- Patent Title (中): 半导体装置及其制造方法
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Application No.: US14468431Application Date: 2014-08-26
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Publication No.: US09129892B2Publication Date: 2015-09-08
- Inventor: Yoshiaki Toyoda , Akio Kitamura
- Applicant: FUJI ELECTRIC CO., LTD.
- Applicant Address: JP
- Assignee: FUJI ELECTRIC CO., LTD.
- Current Assignee: FUJI ELECTRIC CO., LTD.
- Current Assignee Address: JP
- Agency: Rossi, Kimms & McDowell LLP
- Priority: JP2010-138238 20100617
- Main IPC: H01L21/22
- IPC: H01L21/22 ; H01L21/8234 ; H01L27/088 ; H01L29/06 ; H01L29/66 ; H01L29/78 ; H01L21/761 ; H01L21/265 ; H01L29/08 ; H01L29/10

Abstract:
A vertical super junction MOSFET and a lateral MOSFET are integrated on the same semiconductor substrate. The lateral MOSFET is electrically isolated from the vertical super junction MOSFET by an n-buried isolating layer and an n-diffused isolating layer. The lateral MOSFET is formed of a p-well region formed in an n− semiconductor layer bounded by the n-buried isolating layer and n-diffused isolating layer, an n-source region and n-drain region formed in the p-well region, and a gate electrode that covers a portion of the p-well region sandwiched by the n-source region and n-drain region. As the n-buried isolating layer is formed at the same time as an n-layer (3) of the vertical super junction MOSFET, it is possible to reduce cost. Also, it is possible to suppress parasitic action between the elements with the n-buried isolating layer.
Public/Granted literature
- US20140370674A1 SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF Public/Granted day:2014-12-18
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