- Patent Title: Semiconductor encapsulation adhesive composition, semiconductor encapsulation film-like adhesive, method for producing semiconductor device and semiconductor device
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Application No.: US13933230Application Date: 2013-07-02
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Publication No.: US09129898B2Publication Date: 2015-09-08
- Inventor: Kazutaka Honda , Tetsuya Enomoto , Yuuki Nakamura
- Applicant: Hitachi Chemical Company, Ltd.
- Applicant Address: JP Tokyo
- Assignee: Hitachi Chemical Company, Ltd.
- Current Assignee: Hitachi Chemical Company, Ltd.
- Current Assignee Address: JP Tokyo
- Agency: Griffin & Szipl, P.C.
- Main IPC: H01L23/29
- IPC: H01L23/29 ; H01L21/56 ; C09J163/00
Abstract:
A semiconductor encapsulation adhesive composition comprising (a) an epoxy resin, (b) a curing agent and (c) an antioxidant.
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