Invention Grant
- Patent Title: Method of patterning
- Patent Title (中): 图案化方法
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Application No.: US14177755Application Date: 2014-02-11
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Publication No.: US09129909B2Publication Date: 2015-09-08
- Inventor: Katsutoshi Kobayashi
- Applicant: Kabushiki Kaisha Toshiba
- Applicant Address: JP Tokyo
- Assignee: Kabushiki Kaisha Toshiba
- Current Assignee: Kabushiki Kaisha Toshiba
- Current Assignee Address: JP Tokyo
- Agency: Finnegan, Henderson, Farabow, Garrett & Dunner, L.L.P.
- Main IPC: G03F7/00
- IPC: G03F7/00 ; H01L21/311 ; H01L21/02 ; H01L21/027 ; G03F7/004
Abstract:
In a patterning method according to the present embodiment, a guide pattern is formed on a processing target film. The guide pattern is configured by concave portions and convex portions extending in a predetermined direction. A block copolymer layer is formed on the guide pattern. The block copolymer layer contains at least two block chains. A layer of microphase-separated structures is formed on the concave portions and the convex portions, respectively, by microphase-separating the block copolymer layer. The processing target film is formed into predetermined patterns by selectively removing the processing target film. At least a part of the block copolymer layer is used as a mask.
Public/Granted literature
- US20150132964A1 Method of Patterning Public/Granted day:2015-05-14
Information query
