Invention Grant
- Patent Title: Encapsulant, encapsulated substrate having semiconductor devices mounting thereon, encapsulated wafer having semiconductor devices forming thereon, semiconductor apparatus, and method for manufacturing semiconductor apparatus
- Patent Title (中): 具有安装在其上的半导体器件的封装衬底，其上形成有半导体器件的封装晶片，半导体器件和半导体器件的制造方法
-
Application No.: US14066212Application Date: 2013-10-29
-
Publication No.: US09129912B2Publication Date: 2015-09-08
- Inventor: Hideki Akiba , Toshio Shiobara , Susumu Sekiguchi , Tomoaki Nakamura
- Applicant: SHIN-ETSU CHEMICAL CO., LTD.
- Applicant Address: JP Tokyo
- Assignee: SHIN-ETSU CHEMICAL CO., LTD.
- Current Assignee: SHIN-ETSU CHEMICAL CO., LTD.
- Current Assignee Address: JP Tokyo
- Agency: Oliff PLC
- Priority: JP2012-252697 20121116
- Main IPC: H01L23/29
- IPC: H01L23/29 ; H01L23/31 ; H01L21/56
Abstract:
The invention provides an encapsulant for collectively encapsulating a semiconductor devices mounting surface of a substrate having semiconductor devices mounting thereon or a semiconductor devices forming surface of a wafer having semiconductor devices forming thereon, and the encapsulant comprises a supporting substrate having a difference of a linear expansion coefficient from that of the substrate or the wafer of 5 ppm or less and a thermosetting resin layer being laminated, wherein the thermosetting resin layer has a shape having a height difference to a thickness direction.
Public/Granted literature
Information query
IPC分类:
