Invention Grant
US09129921B2 Method of manufacturing nitride semiconductor device, and burn-in apparatus
有权
氮化物半导体器件的制造方法以及老化装置
- Patent Title: Method of manufacturing nitride semiconductor device, and burn-in apparatus
- Patent Title (中): 氮化物半导体器件的制造方法以及老化装置
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Application No.: US14276059Application Date: 2014-05-13
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Publication No.: US09129921B2Publication Date: 2015-09-08
- Inventor: Hajime Sasaki
- Applicant: Mitsubishi Electric Corporation
- Applicant Address: JP Tokyo
- Assignee: MITSUBISHI ELECTRIC CORPORATION
- Current Assignee: MITSUBISHI ELECTRIC CORPORATION
- Current Assignee Address: JP Tokyo
- Agency: Leydig, Voit & Mayer, Ltd.
- Priority: JP2013-179408 20130830
- Main IPC: H01L21/324
- IPC: H01L21/324 ; H01L21/66

Abstract:
A method of manufacturing a nitride semiconductor device, the nitride semiconductor device having an input terminal, a drain terminal, a gate terminal, and an output terminal, includes a burn-in step in which the nitride semiconductor device is heated while inputting an RF signal to the input terminal, applying a drain voltage to the drain terminal, and applying a gate voltage to the gate terminal. The burn-in step is continued until the nitride semiconductor device exhibits a decrease in gate current.
Public/Granted literature
- US20150064811A1 METHOD OF MANUFACTURING NITRIDE SEMICONDUCTOR DEVICE, AND BURN-IN APPARATUS Public/Granted day:2015-03-05
Information query
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