Invention Grant
- Patent Title: Thermal package with heat slug for die stacks
- Patent Title (中): 具有散热片的热封装用于芯片堆叠
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Application No.: US13860705Application Date: 2013-04-11
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Publication No.: US09129929B2Publication Date: 2015-09-08
- Inventor: Nils Lundberg
- Applicant: Sony Mobile Communications AB
- Applicant Address: JP Tokyo SE Lund
- Assignee: Sony Corporation,Sony Mobile Communications AB
- Current Assignee: Sony Corporation,Sony Mobile Communications AB
- Current Assignee Address: JP Tokyo SE Lund
- Agency: Renner, Otto, Boisselle & Sklar LLP
- Priority: EP12170009 20120530
- Main IPC: H01L23/34
- IPC: H01L23/34 ; H01L23/02 ; H01L23/48 ; H01L23/52 ; H01L29/40 ; H01L23/28 ; H01L23/36 ; H01L23/367 ; H01L23/373 ; H01L23/433 ; H01L25/065
Abstract:
A semiconductor assembly comprises a package, which in turn comprises at least one substrate, a first die stacked onto the substrate, at least one further die stacked onto the first die, at least one heat spreader in the package, and TSV:s extending through the stacked dies. The ends of the TSV:s are exposed at the further die.
Public/Granted literature
- US20130277821A1 THERMAL PACKAGE WTH HEAT SLUG FOR DIE STACKS Public/Granted day:2013-10-24
Information query
IPC分类:
