Invention Grant
- Patent Title: Method for shaping a laminate substrate
- Patent Title (中): 层压基板成型方法
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Application No.: US13488685Application Date: 2012-06-05
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Publication No.: US09129942B2Publication Date: 2015-09-08
- Inventor: Edmund D. Blackshear
- Applicant: Edmund D. Blackshear
- Applicant Address: US NY Armonk
- Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
- Current Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
- Current Assignee Address: US NY Armonk
- Agent Matthew Zehrer; Joseph Petrokaitis
- Main IPC: B29C51/46
- IPC: B29C51/46 ; H01L21/48 ; H01L21/683 ; H01L23/00
Abstract:
A method for shaping a laminate substrate includes characterizing the laminate substrate for warpage characteristics over a range of temperatures. The laminate substrate is placed into a shaping fixture with any necessary correction to obtain a flat laminate substrate chip site area at a chip join temperature. The laminate substrate is shaped at a temperature greater than or equal to a maximum laminate substrate fabrication temperature. The shape of the laminate substrate is retained when it is removed from the shaping fixture.
Public/Granted literature
- US20130320578A1 METHOD FOR SHAPING A LAMINATE SUBSTRATE Public/Granted day:2013-12-05
Information query
