Invention Grant
- Patent Title: Coated lead frame bond finger
- Patent Title (中): 涂层引线框结合手指
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Application No.: US14056930Application Date: 2013-10-17
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Publication No.: US09129951B2Publication Date: 2015-09-08
- Inventor: Seng Kiong Teng , Ly Hoon Khoo , Wen Shi Koh
- Applicant: Seng Kiong Teng , Ly Hoon Khoo , Wen Shi Koh
- Applicant Address: US TX Austin
- Assignee: FREESCALE SEMICONDUCTOR, INC.
- Current Assignee: FREESCALE SEMICONDUCTOR, INC.
- Current Assignee Address: US TX Austin
- Agent Charles Bergere
- Main IPC: H01L29/40
- IPC: H01L29/40 ; H01L23/495
Abstract:
A lead frame includes a lead formed of a conductive material and having first and second ends, opposing first and second main surfaces, and opposing first and second side surfaces each extending between the first and second main surfaces. A polymeric layer is formed at least on the first main surface and the first and second side surfaces of the lead at least proximate the second end of the lead. An opening in the polymeric layer on the first main surface of the lead proximate the second end is provided for connecting the lead to, for example, a semiconductor die via a bond wire.
Public/Granted literature
- US20150108623A1 COATED LEAD FRAME BOND FINGER Public/Granted day:2015-04-23
Information query
IPC分类:
