Invention Grant
- Patent Title: Fin field effect transistor and fabrication method
- Patent Title (中): Fin场效应晶体管及其制作方法
-
Application No.: US13777142Application Date: 2013-02-26
-
Publication No.: US09129994B2Publication Date: 2015-09-08
- Inventor: Wenbo Wang
- Applicant: Semiconductor Manufacturing International Corp.
- Applicant Address: CN Shanghai
- Assignee: SEMICONDUCTOR MANUFACTURING INTERNATIONAL CORP.
- Current Assignee: SEMICONDUCTOR MANUFACTURING INTERNATIONAL CORP.
- Current Assignee Address: CN Shanghai
- Agency: Anova Law Group, PLLC
- Priority: CN201210053862 20120302
- Main IPC: H01L21/20
- IPC: H01L21/20 ; H01L29/78 ; H01L29/66 ; H01L21/02 ; H01L27/12 ; H01L21/84

Abstract:
A fin field effect transistor (FET) including a fin structure and a method for forming the fin FET are provided. In an exemplary method, the fin FET can be formed by forming at least one fin seed, including a top surface and sidewalls, on a substrate. A first semiconductor layer can then be formed at least on the sidewalls of the at least one fin seed. A second semiconductor layer can be formed on the first semiconductor layer. The second semiconductor layer and the at least one fin seed can be made of a same material. The first semiconductor layer can be removed to form a fin structure including the at least one fin seed and the second semiconductor layer.
Public/Granted literature
- US20130228863A1 FIN FIELD EFFECT TRANSISTOR AND FABRICATION METHOD Public/Granted day:2013-09-05
Information query
IPC分类: