Invention Grant
- Patent Title: Treatment device, treatment method, and surface treatment jig
- Patent Title (中): 处理装置,处理方法和表面处理夹具
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Application No.: US12514193Application Date: 2007-10-12
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Publication No.: US09129999B2Publication Date: 2015-09-08
- Inventor: Yasumasa Iwata , Akihiko Nakamura
- Applicant: Yasumasa Iwata , Akihiko Nakamura
- Applicant Address: JP Kanagawa
- Assignee: Tokyo Ohka Kogyo Co., Ltd.
- Current Assignee: Tokyo Ohka Kogyo Co., Ltd.
- Current Assignee Address: JP Kanagawa
- Agency: Renner, Otto, Boisselle & Sklar, LLP
- Priority: JP2006-324433 20061130
- International Application: PCT/JP2007/069961 WO 20071012
- International Announcement: WO2008/065820 WO 20080605
- Main IPC: B08B3/04
- IPC: B08B3/04 ; H01L21/67 ; H01L21/02

Abstract:
The treatment device 100 of the present invention is a treatment device for carrying out treatment to a treatment object 18 whose treatment surface includes a second treatment surface 18b and a first treatment surface 18a surrounding the second treatment surface 18b, the treatment device including: a table section 10 for placing the treatment object 18 thereon; and a first feeding section 24 for feeding a first treatment liquid to an approximate boundary between the first and the second treatment surfaces 18a, 18b and a second feeding section 46 for feeding a second treatment liquid to the second treatment surface 18b. Thus, the present invention provides a treatment device, a treatment method, and a surface treatment jig, each of the treatment device and the treatment method being capable of carrying out independent treatments to a treatment surface and an exposed surface surrounding the treatment surface, respectively.
Public/Granted literature
- US20100037916A1 TREATMENT DEVICE, TREATMENT METHOD, AND SURFACE TREATMENT JIG Public/Granted day:2010-02-18
Information query
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