Invention Grant
- Patent Title: Structure for picking up a collector and method of manufacturing the same
- Patent Title (中): 用于拾取收集器的结构及其制造方法
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Application No.: US13899858Application Date: 2013-05-22
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Publication No.: US09130003B2Publication Date: 2015-09-08
- Inventor: Wensheng Qian
- Applicant: SHANGHAI HUA HONG NEC ELECTRONICS CO., LTD
- Applicant Address: CN Shanghai
- Assignee: SHANGHAI HUA HONG NEC ELECTRONICS
- Current Assignee: SHANGHAI HUA HONG NEC ELECTRONICS
- Current Assignee Address: CN Shanghai
- Agency: MKG LLC
- Priority: CN201210163783 20120523
- Main IPC: H01L29/732
- IPC: H01L29/732 ; H01L29/73 ; H01L29/66 ; H01L29/737 ; H01L29/08 ; H01L21/763 ; H01L29/417

Abstract:
A structure for picking up a collector region including a pair of polysilicon stacks formed in the isolation regions and extending below the collector region; and a pair of collector electrodes contacting on the polysilicon stacks, wherein the pair of polysilicon stacks includes: an undoped polysilicon layer and a doped polysilicon layer located on the undoped polysilicon layer, wherein a depth of the doped polysilicon layer is greater than a depth of the collector region; the depth of the collector region is greater than a depth of the isolation regions.
Public/Granted literature
- US20130328047A1 STRUCTURE FOR PICKING UP A COLLECTOR AND METHOD OF MANUFACTURING THE SAME Public/Granted day:2013-12-12
Information query
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