Invention Grant
US09130038B2 Three-dimensional semiconductor memory device, memory system including the same, method of manufacturing the same and method of operating the same 有权
三维半导体存储器件,包括其的存储器系统,其制造方法及其操作方法

Three-dimensional semiconductor memory device, memory system including the same, method of manufacturing the same and method of operating the same
Abstract:
A semiconductor memory device, a memory system including the same, a method of manufacturing the same and a method of operating the same are provided. The semiconductor memory device includes a pipe channel layer, vertical channel layers coupled to a top surface of the pipe channel layer, a first pipe gate substantially surrounding a bottom surface and side surfaces of the pipe channel layer, a boosting gate formed over the pipe channel layer, and first insulating layers and conductive layers alternately stacked over the boosting gate and the pipe channel layer.
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