Invention Grant
- Patent Title: Three-dimensional semiconductor memory device, memory system including the same, method of manufacturing the same and method of operating the same
- Patent Title (中): 三维半导体存储器件,包括其的存储器系统,其制造方法及其操作方法
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Application No.: US13718905Application Date: 2012-12-18
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Publication No.: US09130038B2Publication Date: 2015-09-08
- Inventor: Sa Yong Shim , Kyoung Jin Park
- Applicant: SK hynix Inc.
- Applicant Address: KR Gyeonggi-do
- Assignee: SK Hynix Inc.
- Current Assignee: SK Hynix Inc.
- Current Assignee Address: KR Gyeonggi-do
- Agency: William Park & Associates Ltd.
- Priority: KR10-2012-0096481 20120831
- Main IPC: G11C11/34
- IPC: G11C11/34 ; H01L29/78 ; G11C16/04 ; H01L29/66 ; G11C16/10 ; H01L29/792 ; H01L27/115

Abstract:
A semiconductor memory device, a memory system including the same, a method of manufacturing the same and a method of operating the same are provided. The semiconductor memory device includes a pipe channel layer, vertical channel layers coupled to a top surface of the pipe channel layer, a first pipe gate substantially surrounding a bottom surface and side surfaces of the pipe channel layer, a boosting gate formed over the pipe channel layer, and first insulating layers and conductive layers alternately stacked over the boosting gate and the pipe channel layer.
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