Invention Grant
- Patent Title: Semiconductor device and manufacturing method thereof
- Patent Title (中): 半导体装置及其制造方法
-
Application No.: US13529125Application Date: 2012-06-21
-
Publication No.: US09130044B2Publication Date: 2015-09-08
- Inventor: Yutaka Okazaki , Atsuo Isobe
- Applicant: Yutaka Okazaki , Atsuo Isobe
- Applicant Address: JP Atsugi-shi, Kanagawa-ken
- Assignee: Semiconductor Energy Laboratory Co., Ltd.
- Current Assignee: Semiconductor Energy Laboratory Co., Ltd.
- Current Assignee Address: JP Atsugi-shi, Kanagawa-ken
- Agency: Robinson Intellectual Property Law Office, P.C.
- Agent Eric J. Robinson
- Priority: JP2011-147520 20110701
- Main IPC: H01L29/12
- IPC: H01L29/12 ; H01L29/786

Abstract:
The invention relates to a semiconductor device including an oxide semiconductor layer, a gate electrode overlapping with a channel formation region of the oxide semiconductor layer, and a source electrode or a drain electrode overlapping with a first region of the oxide semiconductor layer, and a second region between the channel formation region and the first region. An upper layer of the second region includes a microvoid. The microvoid is formed by adding nitrogen to the upper layer of the second region. Thus, upper layer of the second region contains lager amount of nitrogen than a lower layer of the second region.
Public/Granted literature
- US20130001557A1 SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF Public/Granted day:2013-01-03
Information query
IPC分类: