Invention Grant
- Patent Title: Thin light emitting diode and fabrication method
- Patent Title (中): 薄型发光二极管及其制造方法
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Application No.: US14021354Application Date: 2013-09-09
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Publication No.: US09130105B2Publication Date: 2015-09-08
- Inventor: Stephen W. Bedell , Bahman Hekmatshoartabari , Devendra K. Sadana , Davood Shahrjerdi
- Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
- Applicant Address: US NY Armonk
- Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
- Current Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
- Current Assignee Address: US NY Armonk
- Agency: Tutunjian & Bitetto, P.C.
- Agent Louis J. Percello
- Main IPC: H01L29/06
- IPC: H01L29/06 ; H01L33/10 ; H01L33/00 ; H01L33/06 ; H01L33/12
Abstract:
A method for fabrication a light emitting diode (LED) includes growing a crystalline LED structure on a growth substrate, forming alternating material layers on the LED structure to form a reflector on a back side opposite the growth substrate and depositing a stressor layer on the reflector. A handle substrate is adhered to the stressor layer. The LED structure is separated from the growth substrate using a spalling process to expose a front side of the LED structure.
Public/Granted literature
- US20150041756A1 THIN LIGHT EMITTING DIODE AND FABRICATION METHOD Public/Granted day:2015-02-12
Information query
IPC分类:
