Invention Grant
- Patent Title: Semiconductor light emitting element and light emitting device
- Patent Title (中): 半导体发光元件及发光元件
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Application No.: US14079245Application Date: 2013-11-13
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Publication No.: US09130128B2Publication Date: 2015-09-08
- Inventor: Hironao Shinohara
- Applicant: TOYODA GOSEI CO., LTD.
- Applicant Address: JP Aichi
- Assignee: TOYODA GOSEI CO., LTD.
- Current Assignee: TOYODA GOSEI CO., LTD.
- Current Assignee Address: JP Aichi
- Agency: Sughrue Mion, PLLC
- Priority: JP2012-250681 20121114
- Main IPC: H01L27/15
- IPC: H01L27/15 ; H01L29/26 ; H01L31/12 ; H01L33/00 ; H01L29/267 ; H01L27/14 ; H01L31/00 ; H01L33/38 ; H01L33/46 ; H01L33/40 ; H01L33/42 ; H01L33/44 ; H01L33/62 ; H01L33/20 ; H01L33/36

Abstract:
A semiconductor light emitting element (1) includes; an n-type semiconductor layer (120), a light emitting layer (130), a p-type semiconductor layer (140), a p-side power supply portion (150), and an n-side power supply portion (160). A p-side power supply electrode (152) in the p-side power supply portion (150) and an n-side power supply electrode (162) in the n-side power supply portion (160) are provided at a rear side of the p-type semiconductor layer (140), a power supply insulating layer (170) set to have a first thickness is formed between the p-type semiconductor layer (140) and the p-side power supply electrode (152) or the n-side power supply electrode (162), and a portion where these electrodes are not provided is set to have a third thickness by forming the protective insulating layer (180) set to have a second thickness in addition to the power supply insulating layer (170).
Public/Granted literature
- US20140131758A1 SEMICONDUCTOR LIGHT EMITTING ELEMENT AND LIGHT EMITTING DEVICE Public/Granted day:2014-05-15
Information query
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