Invention Grant
- Patent Title: Leadframe for optoelectronic components and method for producing optoelectronic components
- Patent Title (中): 光电元件引线框架及光电元件生产方法
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Application No.: US13885912Application Date: 2012-01-31
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Publication No.: US09130136B2Publication Date: 2015-09-08
- Inventor: Martin Brandl , Tobias Gebuhr , Markus Pindl , Albert Schneider
- Applicant: Martin Brandl , Tobias Gebuhr , Markus Pindl , Albert Schneider
- Applicant Address: DE Regensburg
- Assignee: OSRAM Opto Semiconductors GmbH
- Current Assignee: OSRAM Opto Semiconductors GmbH
- Current Assignee Address: DE Regensburg
- Agency: Slater & Matsil, L.L.P.
- Priority: DE102011013259 20110307; DE102011016566 20110408
- International Application: PCT/EP2012/051582 WO 20120131
- International Announcement: WO2012/119813 WO 20120913
- Main IPC: H01L23/495
- IPC: H01L23/495 ; H01L33/62 ; H01L21/56 ; H01L33/00 ; H01L23/00
Abstract:
A leadframe for producing a number of optoelectronic components is specified. At least one mounting region includes a number of chip mounting areas for a number of semiconductor chips. Alongside the mounting region at at least one main area of the leadframe one or more of grooves for reducing mechanical stresses in the leadframe are formed. The groove(s) do not completely penetrate through the leadframe. A method for producing a number of optoelectronic components on a leadframe of this type is furthermore specified.
Public/Granted literature
- US20130309788A1 Leadframe for Optoelectronic Components and Method for Producing Optoelectronic Components Public/Granted day:2013-11-21
Information query
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