Invention Grant
- Patent Title: Resistance variable memory structure and method of forming the same
- Patent Title (中): 电阻变量记忆结构及其形成方法
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Application No.: US13722466Application Date: 2012-12-20
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Publication No.: US09130162B2Publication Date: 2015-09-08
- Inventor: Kuo-Chi Tu , Chih-Yang Chang , Hsia-Wei Chen , Yu-Wen Liao , Chin-Chieh Yang , Wen-Ting Chu
- Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
- Applicant Address: TW
- Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
- Current Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
- Current Assignee Address: TW
- Agency: Lowe Hauptman & Ham, LLP
- Main IPC: H01L45/00
- IPC: H01L45/00 ; H01L27/24

Abstract:
A semiconductor structure includes a resistance variable memory structure. The semiconductor structure also includes a dielectric layer. The resistance variable memory structure is over the dielectric layer. The resistance variable memory structure includes a first electrode disposed over the dielectric layer. The first electrode has a sidewall surface. A resistance variable layer has a first portion which is disposed over the sidewall surface of the first electrode and a second portion which extends from the first portion away from the first electrode. A second electrode is over the resistance variable layer.
Public/Granted literature
- US20140175366A1 RESISTANCE VARIABLE MEMORY STRUCTURE AND METHOD OF FORMING THE SAME Public/Granted day:2014-06-26
Information query
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