Invention Grant
- Patent Title: Communication connector and terminal lead frame thereof
- Patent Title (中): 通讯连接器及其端子引线框架
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Application No.: US14104088Application Date: 2013-12-12
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Publication No.: US09130314B2Publication Date: 2015-09-08
- Inventor: Chung-Nan Pao , Xiao-Yin Wang , Yu-Hsiung Lin
- Applicant: Topconn Electronic (Kunshan) Co., Ltd
- Applicant Address: CN Suzhou, Jiangsu Province
- Assignee: TOPCONN ELECTRONIC (KUNSHAN) CO., LTD.
- Current Assignee: TOPCONN ELECTRONIC (KUNSHAN) CO., LTD.
- Current Assignee Address: CN Suzhou, Jiangsu Province
- Agency: Li & Cai Intellectual Property (USA) Office
- Priority: CN201310426407 20130917
- Main IPC: H01R13/514
- IPC: H01R13/514 ; H01R13/6587

Abstract:
A terminal lead frame comprises a frame and a plurality of terminal pairs set in the frame. The frame is a first dielectric material. The terminal pairs include a first terminal and a second terminal. The first terminal and the second terminal include a first and second extensions extending into the frame along with a first path and a second path, respectively. The first path is longer than the second path, wherein the first extension contacts with a second material to form a first area of contact while the second extension has a second area of contact with respect to the second dielectric material. The first area of contact is larger than the second area of contact.
Public/Granted literature
- US20150079821A1 COMMUNICATION CONNECTOR AND TERMINAL LEAD FRAME THEREOF Public/Granted day:2015-03-19
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