Invention Grant
- Patent Title: Vacuum augmented electroadhesive device
- Patent Title (中): 真空增强电粘合装置
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Application No.: US14052463Application Date: 2013-10-11
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Publication No.: US09130484B2Publication Date: 2015-09-08
- Inventor: Harsha Prahlad , Thomas P. Low , Ronald E. Pelrine
- Applicant: SRI International
- Applicant Address: US CA Menlo Park
- Assignee: SRI International
- Current Assignee: SRI International
- Current Assignee Address: US CA Menlo Park
- Agency: McDonnell Boehnen Hulbert & Berghoff LLP
- Main IPC: H01T23/00
- IPC: H01T23/00 ; H02N13/00 ; H01L21/683

Abstract:
An electroadhesive gripping system includes a vacuum-augmented gripper. The gripper can include an electroadhesive surface associated with one or more electrodes and a load-bearing backing structure coupled to the electroadhesive surface. The backing couples to the backside of the electroadhesive surface so as to at least partially define a shape of the electroadhesive surface. The backing is configured to flex between a curled shape and an uncurled shape. A spreading arm is configured to apply force to the backing so as to flex the backing from the curled shape to the uncurled shape. When positioned next to a substrate, the uncurling motion of the backing can cause the electroadhesive surface to become vacuum sealed to the substrate. A power supply can be configured to apply voltage to the electroadhesive surface.
Public/Granted literature
- US20140036404A1 Vacuum Augmented Electroadhesive Device Public/Granted day:2014-02-06
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