Invention Grant
- Patent Title: Elastic wave device with stacked piezoelectric substrates
- Patent Title (中): 具有堆叠压电基板的弹性波装置
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Application No.: US14589043Application Date: 2015-01-05
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Publication No.: US09130539B2Publication Date: 2015-09-08
- Inventor: Taku Kikuchi , Hisashi Yamazaki
- Applicant: Murata Manufacturing Co., Ltd.
- Applicant Address: JP Kyoto
- Assignee: Murata Manufacturing Co. Ltd.
- Current Assignee: Murata Manufacturing Co. Ltd.
- Current Assignee Address: JP Kyoto
- Agency: Keating & Bennett, LLP
- Priority: JP2012-188535 20120829
- Main IPC: H03H9/70
- IPC: H03H9/70 ; H03H9/72 ; H03H9/64 ; H03H9/05 ; H03H9/02 ; H03H9/54

Abstract:
An elastic wave device includes a first elastic wave element, a second elastic wave element, and a first substrate. The first elastic wave element includes a first piezoelectric substrate. The second elastic wave element includes a second piezoelectric substrate. The second piezoelectric substrate is stacked on the first piezoelectric substrate. A coefficient of linear expansion of the second piezoelectric substrate is greater than a coefficient of linear expansion of the first piezoelectric substrate. The first substrate is bonded to the second piezoelectric substrate. A coefficient of linear expansion of the first substrate is lower than the coefficient of linear expansion of the second piezoelectric substrate.
Public/Granted literature
- US20150109071A1 ELASTIC WAVE DEVICE Public/Granted day:2015-04-23
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