Invention Grant
US09131607B2 Lowdielectric resin composition, copper clad laminate using the same, and printed circuit board using the same
有权
低电导率树脂组合物，使用该低电导率树脂组合物的覆铜层压板以及使用其的印刷电路板
- Patent Title: Lowdielectric resin composition, copper clad laminate using the same, and printed circuit board using the same
- Patent Title (中): 低电导率树脂组合物，使用该低电导率树脂组合物的覆铜层压板以及使用其的印刷电路板
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Application No.: US13777477Application Date: 2013-02-26
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Publication No.: US09131607B2Publication Date: 2015-09-08
- Inventor: Rong-Tao Wang , Tse-An Lee , Yi-Jen Chen , Wenjun Tian , Ziqian Ma , Wenfeng Lu
- Applicant: ELITE ELECTRONIC MATERIAL (KUNSHAN) CO., LTD
- Applicant Address: CN Jiangsu Province
- Assignee: ELITE ELECTRONIC MATERIAL (KUNSHAN) CO., LTD.
- Current Assignee: ELITE ELECTRONIC MATERIAL (KUNSHAN) CO., LTD.
- Current Assignee Address: CN Jiangsu Province
- Agency: WPAT, P.C.
- Agent Anthony King
- Priority: CN201210562188 20121221
- Main IPC: C08L63/00
- IPC: C08L63/00 ; H05K1/03 ; B32B15/14 ; B32B15/20
Abstract:
A halogen-free resin composition includes (A) 100 parts by weight of naphthalene epoxy resin; (B) 10 to 100 parts by weight of styrene maleic anhydride copolymer; and (C) 30 to 70 parts by weight of DOPO-containing bisphenol F novolac resin. The halogen-free resin composition includes specific ingredients, and is characterized by specific proportions thereof, to thereby attain a low dielectric constant, a low dielectric dissipation factor, high heat resistance, and high flame retardation, and thus is suitable for producing a prepreg or a resin film to thereby be applicable to copper clad laminates and printed circuit boards.
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