Invention Grant
- Patent Title: Waterproof structure for electronic device
- Patent Title (中): 电子设备防水结构
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Application No.: US14124341Application Date: 2011-06-23
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Publication No.: US09131609B2Publication Date: 2015-09-08
- Inventor: Kazuyuki Ochiai , Yoshiaki Hirakata , Akira Shirai , Masao Okada , Masahiko Yamaguchi
- Applicant: Kazuyuki Ochiai , Yoshiaki Hirakata , Akira Shirai , Masao Okada , Masahiko Yamaguchi
- Applicant Address: JP Tokyo
- Assignee: HONDA MOTOR CO., LTD.
- Current Assignee: HONDA MOTOR CO., LTD.
- Current Assignee Address: JP Tokyo
- Agency: Rankin, Hill & Clark LLP
- International Application: PCT/JP2011/064401 WO 20110623
- International Announcement: WO2012/176303 WO 20121227
- Main IPC: H05K5/06
- IPC: H05K5/06 ; B62K19/30 ; B62J9/00 ; B60R16/02 ; B60R16/023 ; H02G3/08 ; H01R13/52

Abstract:
A waterproof structure for an electronic device (60) includes: a case (130) which is disposed in a location in a vehicle (10) distant from a receiving antenna (61), which houses a processing unit (69) that processes location information, and which has a wiring hole (171) through which a wire (62) passes; a cylindrical part (172) which extends in the axial direction of the wire from the case in such a manner as to surround the wiring hole; a seal member (167) which is housed in a compressed state in the cylindrical part, and surrounds the wire; and a cap (160) which is attached to the case in an attachable/detachable manner, has a hole (168) through which the wire passes, and prevents the seal member from moving.
Public/Granted literature
- US20140197656A1 WATERPROOF STRUCTURE FOR ELECTRONIC DEVICE Public/Granted day:2014-07-17
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