Invention Grant
- Patent Title: Reducing formation of oxide on solder
- Patent Title (中): 减少焊料上氧化物的形成
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Application No.: US14468660Application Date: 2014-08-26
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Publication No.: US09132496B2Publication Date: 2015-09-15
- Inventor: Buu Q. Diep , Thomas A. Kocian , Roland W. Gooch
- Applicant: Raytheon Company
- Applicant Address: US MA Waltham
- Assignee: Raytheon Company
- Current Assignee: Raytheon Company
- Current Assignee Address: US MA Waltham
- Agency: Daly, Crowley, Mofford & Durkee, LLP
- Main IPC: B23K31/02
- IPC: B23K31/02 ; B23K1/20 ; B23K1/00 ; B23K1/008 ; B23K3/047 ; B23K3/08 ; H01L21/67 ; H01L23/00
Abstract:
In certain embodiments, a system includes a deposition system and a plasma/bonding system. The deposition system deposits a solder outwardly from a substrate of a number of substrates. The plasma/bonding system comprises a plasma system configured to plasma clean the substrate and a bonding system configured to bond the substrates. The plasma/bonding system at least reduces reoxidation of the solder. In certain embodiments, a method comprises depositing solder outwardly from a substrate, removing metal oxide from the substrate, and depositing a capping layer outwardly from the substrate to at least reduce reoxidation of the solder.
Public/Granted literature
- US20150076216A1 REDUCING FORMATION OF OXIDE ON SOLDER Public/Granted day:2015-03-19
Information query
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