Invention Grant
- Patent Title: Substrate defect detection mechanism
- Patent Title (中): 基板缺陷检测机制
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Application No.: US13973088Application Date: 2013-08-22
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Publication No.: US09132665B2Publication Date: 2015-09-15
- Inventor: Scott Richard Johnson , Harry Reese Lewis , Casey Ethan Walker
- Applicant: Scott Richard Johnson , Harry Reese Lewis , Casey Ethan Walker
- Applicant Address: JP Tokyo
- Assignee: Ricoh Company, Ltd.
- Current Assignee: Ricoh Company, Ltd.
- Current Assignee Address: JP Tokyo
- Agency: Blakely, Sokoloff, Taylor & Zafman LLP
- Main IPC: B41J29/393
- IPC: B41J29/393 ; B41J11/00 ; G01N21/89 ; G01N21/898
Abstract:
A method is disclosed. The method includes one or more light field cameras recording image data of a substrate during printing to the substrate and a control unit processing the image data received from the one or more light field cameras to identify defect areas in the substrate.
Public/Granted literature
- US20150054880A1 Substrate Defect Detection Mechanism Public/Granted day:2015-02-26
Information query
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