Invention Grant
- Patent Title: Ceramic electronic component, method of manufacturing the same, and collective component
- Patent Title (中): 陶瓷电子部件及其制造方法以及集体部件
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Application No.: US14044383Application Date: 2013-10-02
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Publication No.: US09136057B2Publication Date: 2015-09-15
- Inventor: Hiroto Itamura
- Applicant: MURATA MANUFACTURING CO., LTD.
- Applicant Address: JP Nagaokakyo-Shi, Kyoto-Fu
- Assignee: MURATA MANUFACTURING CO., LTD.
- Current Assignee: MURATA MANUFACTURING CO., LTD.
- Current Assignee Address: JP Nagaokakyo-Shi, Kyoto-Fu
- Agency: Arent Fox LLP
- Priority: JP2009-248544 20091029
- Main IPC: H01G4/30
- IPC: H01G4/30 ; H01G4/12 ; H01G4/232
Abstract:
A collective component has a first region that intersects with a conductive film for external terminal electrodes in a break line in which break leading holes are arranged and a second region that does not intersect with the conductive film for external terminal electrodes in the break line. The plurality of break leading holes includes at least one extending break leading hole located so as to extend over the first region and the second region.
Public/Granted literature
- US20140029160A1 CERAMIC ELECTRONIC COMPONENT, METHOD OF MANUFACTURING THE SAME, AND COLLECTIVE COMPONENT Public/Granted day:2014-01-30
Information query
