Invention Grant
- Patent Title: Expanded semiconductor chip and semiconductor device
- Patent Title (中): 扩展半导体芯片和半导体器件
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Application No.: US14150856Application Date: 2014-01-09
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Publication No.: US09136219B2Publication Date: 2015-09-15
- Inventor: Teppei Iwase , Kiyomi Hagihara
- Applicant: Panasonic Corporation
- Applicant Address: JP Osaka
- Assignee: Panasonic Corporation
- Current Assignee: Panasonic Corporation
- Current Assignee Address: JP Osaka
- Agency: Panasonic Patent Center
- Priority: JP2011-250758 20111116
- Main IPC: H01L23/48
- IPC: H01L23/48 ; H01L23/52 ; H01L29/40 ; H01L23/538 ; H01L23/00 ; H01L25/065
Abstract:
A semiconductor device includes: a first semiconductor chip having a surface provided with first electrodes; and an expanded semiconductor chip including a second semiconductor chip and an expanded portion extending outward from at least one side surface of the second semiconductor chip. The expanded semiconductor chip has a surface provided with second electrodes. The surface of the first semiconductor chip provided with the first electrodes faces the surface of the expanded semiconductor chip provided with the second electrodes so that the first electrodes are connected to the second electrodes. Each one of the second electrodes that is connected to an associated one of the first electrodes is located only on the expanded portion.
Public/Granted literature
- US20140124957A1 EXPANDED SEMICONDUCTOR CHIP AND SEMICONDUCTOR DEVICE Public/Granted day:2014-05-08
Information query
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