A carrier-free land grid array (LGA) Integrated Circuit (IC) chip package and a preparation method thereof are provided. The IC chip package includes: an inner pin, an IC chip, a pad, a bonding wire, and a mold cap. The inner pin is designed to be a multi-row matrix form at a front side of the package, and is designed to be an exposed multi-row approximate square-shaped circular gold-plated contacts at a back side; the IC chip is provided on the inner pin, the inner pin is adhered to the IC chip with an adhesive film sheet, the pad on the IC chip is connected to the inner pin by the bonding wire, and the mold cap encircles the adhesive film sheet, the IC chip, the bonding wire, and edges of the inner pin, so as to form a whole circuit. The present invention adopts approximate square-shaped spherical array contacts, thereby having a simple and flexible structure, and achieving a desirable heat-dissipation effect. A cooper lead frame (L/F) has a high yield, and reduces the material cost. The L/F is used to replace a ceramic substrate, PCB substrate, or BT substrate, thereby saving the complicated layout design, shortening the designing and manufacturing cycle, accelerating the trial production course, and enabling the product to be early listed to obtain market opportunities.