Invention Grant
- Patent Title: Moisture barrier for a wire bond
- Patent Title (中): 导线键合的水分屏障
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Application No.: US14283602Application Date: 2014-05-21
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Publication No.: US09136245B2Publication Date: 2015-09-15
- Inventor: John M. DeLucca , Ronald J. Weachock , Barry J. Dutt , Frank A. Baiocchi , John W. Osenbach
- Applicant: LSI Corporation
- Applicant Address: SG Singapore
- Assignee: Avago Technologies General IP (Singapore) Pte. Ltd
- Current Assignee: Avago Technologies General IP (Singapore) Pte. Ltd
- Current Assignee Address: SG Singapore
- Main IPC: H01L23/485
- IPC: H01L23/485 ; H01L23/00 ; H01L23/31
Abstract:
An electronic device comprising a bond pad on a substrate and a wire bonded to the bond pad. The device further comprises an intermetallic compound interface located between the bond pad and the wire and a silicon nitride or silicon carbonyl layer covering the intermetallic compound interface.
Public/Granted literature
- US20140349475A1 MOISTURE BARRIER FOR A WIRE BOND Public/Granted day:2014-11-27
Information query
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