Invention Grant
- Patent Title: Semiconductor device
- Patent Title (中): 半导体器件
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Application No.: US13983051Application Date: 2012-02-01
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Publication No.: US09136322B2Publication Date: 2015-09-15
- Inventor: Yuki Nakano , Ryota Nakamura
- Applicant: Yuki Nakano , Ryota Nakamura
- Applicant Address: JP Kyoto
- Assignee: ROHM CO., LTD.
- Current Assignee: ROHM CO., LTD.
- Current Assignee Address: JP Kyoto
- Agency: Rabin & Berdo, P.C.
- Priority: JP2011-020730 20110202; JP2011-101786 20110428
- International Application: PCT/JP2012/052293 WO 20120201
- International Announcement: WO2012/105613 WO 20120809
- Main IPC: H01L29/66
- IPC: H01L29/66 ; H01L29/06 ; H01L29/10 ; H01L29/78 ; H01L27/088 ; H01L29/08 ; H01L29/417 ; H01L29/16

Abstract:
A semiconductor device includes a semiconductor layer made of a wide bandgap semiconductor and including a gate trench; a gate insulating film formed on the gate trench; and a gate electrode embedded in the gate trench to be opposed to the semiconductor layer through the gate insulating film. The semiconductor layer includes a first conductivity type source region; a second conductivity type body region; a first conductivity type drift region; a second conductivity type first breakdown voltage holding region; a source trench passing through the first conductivity type source region and the second conductivity type body region from the front surface and reaching a drain region; and a second conductivity type second breakdown voltage region selectively formed on an edge portion of the source trench where the sidewall and the bottom wall thereof intersect with each other in a parallel region of the source trench.
Public/Granted literature
- US20130306983A1 SEMICONDUCTOR DEVICE AND METHOD FOR PRODUCING SAME Public/Granted day:2013-11-21
Information query
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